- 2009 08 - sep. doc. no : qw0905- rev. : date : la256b/hrfsbks.x.x-pf a data sheet la256b/hrfsbks.x.x-pf led array pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
2.54typ 2.54typ 9.85 ? 3.0*3 ? 3.35*3 3.2 la256b/hrfsbks.x.x-pf part no. 14.8 hrf sbks 1/6 page
note : 1.the forward voltage data did not including ? ? discharge( * ) -30 ~ +100
typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only page 3/6 part no. la256b/hrfsbks.x.x-pf f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5
typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only page 4/6 part no. la256b/hrfsbks.x.x-pf f o r w a r d c u r r e n t @ 2 0 m a 10 r e l a t i v e i n t e n s i t y @ 2 0 m a 0 0 ambient temperature(
ligitek electronics co.,ltd. property of ligitek only page 5/6 part no. la256b/hrfsbks.x.x-pf dip soldering preheat: 120 50 60 seconds max 0 0 preheat 25 120 100 time(sec) 150 temp( 260
the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. 1.t.sol=230
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